Vertiv Expands Liquid Cooling Portfolio to Accelerate AI‑Ready Data Center Deployments
2026-06-02
Vertiv today announced the expansion of its end-to-end thermal chain with the availability of the Vertiv CoolChip CDU 2300 and Vertiv CoolChip Fluid Network Row Manifolds. These liquid cooling technologies support the growing demands of AI and high-density, next-generation compute to help customers deploy high-density infrastructureRead More…
