Qualcomm announced new data center solutions, including the Qualcomm Dragonfly C1000 CPU, Qualcomm High Bandwidth Compute (HBC), Qualcomm Dragonfly AI300 inference accelerator, and connectivity products, together with custom silicon solutions, all engineered to maximize performance per watt and token throughput at lower total cost of ownership.
The new platforms highlight Qualcomm Technologies’ growing role in building full‑stack data center infrastructure optimized for AI, spanning agentic and data‑center‑class CPUs, AI inference accelerators, high‑performance connectivity, and at scale custom silicon solutions. The Qualcomm Dragonfly AI300 joins the previously announced Qualcomm Dragonfly AI200 and AI250 in its data center solutions portfolio with an annual cadence AI accelerator roadmap.
“Agentic AI is driving a significant increase in demand for AI inference in the data center. As these become the dominant workloads, infrastructure has to deliver much higher performance at lower power and cost,” said Cristiano Amon, President and CEO, Qualcomm Incorporated. “That plays directly to Qualcomm’s strengths, and we’re well positioned for this shift. With Qualcomm Dragonfly, we’re bringing our high-performance, low-power computing into the data center, with multi-year, multi-generation agreements with leading customers.”
Inference-First Platforms Built for Hyperscalers
Qualcomm Technologies draws on decades of expertise in systems-on-chips (SoCs), low-power design, high-performance processing, and leading IP, combined with experience engineering over 40 billion components, to deliver disaggregated, rack-scale AI infrastructure designed for data-center-grade, agent-intensive AI inference workloads at hyper scale. These innovations enable improved token economics, low latency, simplified integration, scalable deployment, and lower total cost of ownership. As agentic AI dramatically increases token demand, Qualcomm Technologies’ solutions are optimized for tokens-per-watt as the key lever to reduce total cost of ownership (TCO).
“What enterprises need now goes far beyond individual components. Orchestrating multiple types of compute across distributed, always-on infrastructure is critical,” said Tony Pialis, EVP and GM, Data Center, Qualcomm Technologies, Inc. “With Qualcomm Dragonfly, we’re bringing together compute, AI, memory, and connectivity into a unified, rack-scale platform designed for increasingly complex, agent-driven workloads while addressing key bottlenecks in memory bandwidth and power consumption. This builds on what Qualcomm Technologies has been delivering for decades: high-performance, low-power compute at scale, now applied to the data center in a way that very few companies can match.”
